micro EDM combined with micro ultrasonic vibration machining free research paper
Because of its excellent anodic bonding property and surface integrity, borosilicate glass is usually used as the substrate for micro-electro mechanical systems (MEMS). For building the communication interface, micro-holes need to be drilled on this substrate. However, a micro-hole with diameter below 200 μm is difficult to manufacture using traditional machining processes. To solve this problem, a machining method that combines micro electrical-discharge machining (MEDM) and micro ultrasonic vibration machining (MUSM) is proposed herein for producing precise micro-holes with high aspect ratios in borosilicate glass. In the investigations described in this paper, a circular micro-tool was produced using the MEDM process. This tool was then used to drill a hole in glass using the MUSM process.